Samsung's three-phase HBM roadmap announced at Hot Chips 2026. It transitions the base die to advanced logic processes, culminating in zHBM that stacks DRAM directly on top of the processor.
High-Bandwidth Flash (HBF) developed by Sandisk and SK Hynix stacks 16 layers of NAND flash, achieving 512GB capacity and 1.6TB/s bandwidth. While expected as an alternative to HBM, it still faces fundamental challenges in write endurance and latency.
Samsung has overtaken Nvidia to become the world's most profitable technology firm in Q2 2026. Its semiconductor division's annual profit is projected to exceed the cumulative total of the past 40 years.
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