Qualcomm Introduces AI Accelerator "HBC" with Compute Units Under DRAM
Qualcomm unveils its new "High-Bandwidth Compute (HBC)" AI accelerator architecture for data centers, promising 768GB of memory and 133TB/s bandwidth.
Qualcomm unveils its new "High-Bandwidth Compute (HBC)" AI accelerator architecture for data centers, promising 768GB of memory and 133TB/s bandwidth.
Qualcomm unveils its flagship chip for AR/MR headsets, the Snapdragon Reality Elite, debuting with Xreal Aura. START platform aims to expand the smart glasses market.
Intel has released version 2.5.12 of its Linux thermal control daemon, Thermald. The standout feature is initial support for the ARM architecture, contributed by Qualcomm engineers.
Radxa unveils the ultra-compact single-board computer "Dragon Q5E," featuring a Qualcomm Dragonwing Q-6690 processor, WiFi 7, Bluetooth 6, dual 2.5GbE LAN, GPIO, and an integrated UHF RFID reader in a compact 65×56mm body.
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